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SKU 7100197600
Legacy SKU JT940011722
UPC 04549395856817
Catalog Number 5550H-10
Product Number 5550H-10

3M Thermally Conductive Acrylic Interface Pad 5550H is a highly conformable and ultra-soft pad with high thermal conductivity of 3.0 W/m-K (3M test method). This pad consists of a slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.

  • Very soft but good handling
  • Good softness and conformability even to non-flat IC surfaces
  • Incorporates a thin firm acrylic layer for good handling
  • Good thermal conductivity and good electrical insulation properties
  • Slight tack allows pre-assembly. Good wettability for better thermal conductivity
  • UL94 V-0 certified (File No, E176845)
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On it's way to you July 31  

Qty

Minimum Order 5 Rolls
Order Increment 5 Rolls
  Excellent Thermal Management
  Versatile Across Industries
  Global Shipping
  Industry Low Price
Product Dimensions
Imperial Metric
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Shipping Dimensions
Weight 40.786 lb
Length 11.41693 in
Width 10.23583 in
Height 10.23583 in

PRODUCT FAQ

  1. What is 3M™ Thermally Conductive Acrylic Interface Pad 5550H-10 and what are its features?

    3M™ Thermally Conductive Acrylic Interface Pad 5550H-10 is a high-performance thermal interface material designed to offer excellent thermal conductivity, higher reliability, longer durability and consistent performance even in harsh environments. The pad can transfer heat from a heat-generating component or device to the chassis heat dissipating surfaces quickly and effectively.

  2. How does it differ from other thermally conductive materials available in the market?

    This particular formulation has an acrylic adhesive on both sides of a specially formulated polymer.

  3. This provides numerous benefits, like good wet out (full wetting) of rough surfaces.

    Both-sided coating also reduces installation time since there's no need for supplemental material application.

  4. How does one use it? Is it easy-to-use by non-professional installers as well?

    Yes -most definitely! The pads can easily be cut using conventional methods such as scissors or rotary die-cuts. Our highly experienced team members are always available to provide valuable assistance with training videos and webinars

  5. We proudly stand behind all our products because we know that they're engineered to bring value-added advantages!

    Q:. Can this product work satisfactorily under extreme temperatures?

  6. A:. Absolutely yes -Our proprietary formulation undergoes rigorous testing procedures before product release so that customers receive nothing but optimal quality materials capable of delivering unparalleled performance under severe conditions. Thus These

3M™ Thermally Conductive Acrylic Interface Pad 5550H has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.


Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.


Recommended Applications:

  • Heat transfer between PCB and heat sink
  • Decrease of compression stress to electronic parts by thermal pad softness
  • Gap filling in electronic devices
  • Chip on film (COF) heat dissipation
  • Power electronic component thermal management

Examples:

  • LED displays
  • Electric vehicle (EV) batteries
  • Wireless charging units
  • Satellite navigation
  • Sensors
  • Process control equipment
  • Test & measurement devices
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