3M™ Thermally Conductive Acrylic Interface Pad 5550H is a highly conformable and ultra-soft pad with high thermal conductivity of 3.0 W/m-K (3M test method). This pad consists of a slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.
- Very soft but good handling
- Good softness and conformability even to non-flat IC surfaces
- Incorporates a thin firm acrylic layer for good handling
- Good thermal conductivity and good electrical insulation properties
- Slight tack allows pre-assembly. Good wettability for better thermal conductivity
- UL94 V-0 certified (File No, E176845)
|Width||9.449 in||240 mm|
|Length||98 ft||30 m|
Brochures, Catalogs & Data Sheets
- Pdf Data Sheets_3m thermally condu
- Data Sheet
3M™ Thermally Conductive Acrylic Interface Pad 5550H has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management
Electric vehicle (EV) batteries
Wireless charging units
Process control equipment
Test & measurement devices