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SKU 7000121222
Legacy SKU 62232430017
UPC 00021200204562
Catalog Number AF111
Product Number AF111

3M Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).

  • Moderate tack
  • Thick 10 mil caliper
  • 250° F (121° C) cure
  • High metal OLS and peel adhesion
  • High flow
  • 40° F (4° C) storage required
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On it's way to you January 12  

Qty

Minimum Order 5 Rolls
Order Increment 5 Rolls
Product Dimensions
Imperial Metric
Weight 0 NULL
Width 0 null
Length 0 null
Height 0 null
Thickness 17.9 mil 0.45 mm
Shipping Dimensions
Weight 14.50201 lb
Length 8.50394 in
Width 8.50394 in
Height 41.73228 in
Color Off White

PRODUCT FAQ

  1. Sure, here are some questions and answers

    What are the key features of 3M™ Thermal Bonding Film AF111?

  2. The 3M™ Thermal Bonding Film AF111 is known for its excellent adhesion to various substrates, high temperature resistance, and durability.

    How big are the rolls of 3M™ Thermal Bonding Film AF111 in this case?

  3. Each roll in the case measures 7 inches wide by 36 yards long, providing plenty of material for your bonding needs.

    Is the 3M™ Thermal Bonding Film AF111 easy to apply?

  4. Yes! This film is designed for easy application with a simple heat activation process, making it suitable for a variety of applications.

    Can I use this bonding film on different types of materials?

  5. Absolutely! The versatility of the 3M™ Thermal Bonding Film AF111 allows you to bond various materials such as fabrics, foams, and plastics.

    How many cases do I get if I order this product?

  6. When you place an order for the 3M™ Thermal Bonding Film AF111, you will receive 5 cases in total.

This hot melt film adhesive offers exceptional strength and versatility for a variety of applications.

With the ability to be cured at temperatures as low as 225 degrees Fahrenheit, this adhesive is perfect for bonding metal to metal or creating honeycomb sandwich structures. Its low curing temperature allows for efficient and effective bonding without compromising the integrity of the materials being joined.

One of the key advantages of this adhesive is that it releases no volatile by-products during the curing process. This means that it can be used for low pressure bonding, reducing the risk of damage to delicate or sensitive materials. The absence of volatile by-products also makes it a safer and more environmentally friendly option.

With a standard lead time of 30 calendar days, you can rely on this hot melt film adhesive to be readily available when you need it. Whether you are working on a time-sensitive project or require a consistent supply for ongoing production, this adhesive is designed to meet your needs.

For more information about this hot melt film adhesive and its applications, please visit our website at https://www.3m.com.

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