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3M™ Thermally Conductive Silicone Interface Pad 5591, 210 mm x 300 mm x 2.5 mm, 10 Sheets/Box
$25.29 / Sheet
| SKU | 7010321481 |
|---|---|
| Legacy SKU | WX300901310 |
| UPC | 08806080063735 |
| Catalog Number | 5591 |
| Product Number | 5591-25 |
3M Thermally Conductive Silicone Interface Pad 5591 is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a ultra soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
Product Dimensions |
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Shipping Dimensions |
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| Weight | 6.50364 lb |
|---|---|
| Length | 8.66142 in |
| Width | 12.59843 in |
| Height | 2.55906 in |
PRODUCT FAQ
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What is the size of each sheet of 3M™ Thermally Conductive Silicone Interface Pad 5591?
Each sheet of the 3M™ Thermally Conductive Silicone Interface Pad 5591 measures 210 mm x 300 mm x2.5 mm.
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How many sheets are included in one box?
There are ten sheets included in one box of the 3M™ Thermally Conductive Silicone Interface Pad 5591.
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Is this interface pad electrically conductive as well?
No, this interface pad is thermally conductive only and does not have electrical conductivity characteristics.
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Will it work with all types/sizes of electronic components a customer uses for their project?
The usage will depend on various factors such as sizes/type/components, but our team can provide you with technical support to advise whether or not it's a good fit for your specific application.
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Can I cut these pads into smaller shapes/sizes to meet my project needs?
. Yes, you may use scissors or other cutting tools to reshape and resize the silicone pads according to your requirements.
3M™ Thermally Conductive Silicone Interface Pad 5591 has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.