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3M™ Thermally Conductive Acrylic Interface Pad 5589H-10, 220 mm x 220 mmx 1.0 mm, 30 Sheets/Case

3M™

$13.67 / Sheet

SKU 7010352548
Legacy SKU JT940010211
UPC 00638060825549

3M™ Thermally Conductive Acrylic Interface Pad 5589H is an acrylic elastomer based interface pad. It has high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non silicone properties.

  • Good softness and conformability to non-flat surfaces
  • Excellent compressive stress relaxation
  • Non-silicone acrylic elastomer
  • Good dielectric performance
  • Good surface tack leads to low thermal resistance at surface
  • Thickness : 1.0 mm, 1.5 mm
  • Excellent durability for long term thermal conductivity and electric insulation stability
Estimated date of shipment August 8  

Qty

Minimum Order 30 Sheets
Order Increment 30 Sheets
Product Dimensions
 Imperial Metric
Width 8.661 in 220 mm
Shipping Dimensions
Weight 7.2752 lb
Length 16.141 in
Width 11.811 in
Height 3.149 in
Brochures, Catalogs & Data Sheets

3M™ Thermally Conductive Acrylic Interface Pad 5589H has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.




Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.




Recommended Applications:
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management




Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices

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