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SKU 7010403025
Legacy SKU JT200085218
UPC 00051141414744
Catalog Number 3305
Product Number 3305

3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power
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On it's way to you July 24  

Qty

Minimum Order 120 Rolls
Order Increment 120 Rolls
Product Dimensions
Imperial Metric
Shipping Dimensions
Weight 19.8416 lb
Length 9.84252 in
Width 9.84252 in
Height 10.23622 in
Color Transparent

PRODUCT FAQ

  1. What are the benefits of using 3M™ Polyester Delaminating Tape 3305?

    The tape offers excellent adhesion and clean removal, making it ideal for delaminating processes without leaving residue behind. It also provides good tensile strength and temperature resistance.

  2. Can I use this tape for outdoor applications?

    Yes, 3M™ Polyester Delaminating Tape 3305 is suitable for outdoor use as it offers good weather resistance.

  3. How wide and long is each roll of the tape?

    Each roll of the tape measures 50 mm in width and comes in a length of 100 meters (approximately 328 feet).

  4. Is this product easy to apply and remove?

    Yes, the tape is designed for easy application and clean removal, providing convenience during delamination processes.

A Transparent Polyester Film Tape for Silicon Wafer Backgrinding Tape Removal

Introducing our innovative transparent polyester film tape, specially engineered with an aggressive rubber adhesive. This tape is specifically designed to effectively remove silicon wafer backgrinding tape, ensuring a seamless and efficient process.

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