Slip Stream 24/7 – Global Supply and Distribution Company providing 3M Industrial, Commercial & Safety Solutions
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SKU 7010405205
Legacy SKU WX300909594
UPC 00051115240799
Part Number 5516S-10

3M™ Thermally Conductive Silicone Interface Pad 5516S is the same as 3M Pad 5516 but with a polymeric permanent film on 1 side for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes, dielectric strength is improved.

  • Good thermal conductivity (3.1 w/m-K)
  • Good softness and is conformable at low pressure ( Shore 00 =72)
  • Softness results in low stress on board components
  • Good dielectric properties
  • “S” version incorporates a thin polymeric film carrier for improved handling and a non-tacky surface for ease of rework
  • Slight tack allows pre-assembly
  • Good wettability for better thermal conductivity
  • UL 94 V-1
  • High temperature resistance
  • Tacky both sides
  • Thickness: 1.0 mm
  • Larger sheet size is available
Estimated date of shipment August 25  

Qty

Minimum Order 120 Sheets
Order Increment 120 Sheets
Product Dimensions
Imperial Metric
Weight 19.4007 LBS
Width 12.598 in 320 mm
Shipping Dimensions
Weight 20.5029 lb
Length 10.433 in
Width 13.188 in
Height 2.559 in
Brochures, Catalogs & Data Sheets

3M™ Thermally Conductive Silicone Interface Pad 5516S has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.




Recommended Applications:
Heat transfer between PCB and heat sink
Integrated chip (IC) packaging heat conduction
Chip on film (COF) heat dissipation
Gap filling in electronic devices
Decrease of compression stress to electronic parts by thermal pad softness




Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices




Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.

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