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SKU 7010405246
Legacy SKU WX300950648
UPC 08806080063988
Catalog Number 5584
Product Number 5584-10

3M Thermally Conductive Silicone Interface Pad 5584 is a soft, silicone elastomer with thermal conductivity of 1.1 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties.

  • Good thermal stability of the base polymer with excellent softness of the thermal pad
  • Good thermal conductivity in a soft silicone polymer base
  • The product tack is such that a mechanical means to support the pad in a final assembly is required
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On it's way to you June 14  

Qty

Minimum Order 200 Sheets
Order Increment 200 Sheets
  Excellent Thermal Management
  Versatile Across Industries
  Global Shipping
  Industry Low Price
Product Dimensions
Imperial Metric
Shipping Dimensions
Weight 14.33 lb
Length 8.661 in
Width 12.598 in
Height 2.559 in

PRODUCT FAQ

  1. What are the dimensions of the 3M™ Thermally Conductive Silicone Interface Pad 5584?

    The dimensions are 210 mm x 300 mm x 1.0 mm.

  2. How does this pad compare to other thermal interface materials?

    This pad has excellent thermal conductivity and can provide an alternative solution to traditional thermal compounds or greases.

  3. Is it easy to install on electronic components such as a CPU or GPU?

    Yes, installation is simple. Just peel off the protective liner and apply the pad onto your component.

  4. Can this product be cut into custom shapes for specific applications?

    Absolutely! These pads can be easily cut using scissors or a sharp blade, making them adaptable to any size you need for your application.

3M™ Thermally Conductive Silicone Interface Pad 5584 has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.


Recommended Applications:

  • Heat transfer between PCB and heat sink
  • Integrated chip (IC) packaging heat conduction
  • Chip on film (COF) heat dissipation
  • Gap filling in electronic devices
  • Decrease of compression stress to electronic parts by thermal pad softness

Examples:

  • LED displays
  • Electric vehicle (EV) batteries
  • Wireless charging units
  • Satellite navigation
  • Sensors
  • Process control equipment
  • Test & measurement devices

Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.

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