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3M™ Thermally Conductive Silicone Interface Pad 5549S, 210 mm x 155 mm x 0.5 mm
$32.10 / Sheet
| SKU | 7010405249 |
|---|---|
| Legacy SKU | WX300950721 |
| UPC | 00051131289109 |
| Catalog Number | 5549S |
| Product Number | 5549S-05 |
3M Thermally Conductive Silicone Interface Pad 5549S is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide preferential heat transfer path between heat generating components and heat sinks or other cooling devices.
- Very high thermal conductivity and good electrical insulation properties
- Good softness and conformability even to non-flat surfaces
- Thin polymeric film carrier supported on 1 side for good converting and handling properties
- Slight tack allows pre-assembly
- Good dielectric properties
- Good wettability for better thermal conductivity
Product Dimensions |
Imperial | Metric |
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| Width | 0 null | |
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Shipping Dimensions |
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| Weight | 10.18536 lb |
|---|---|
| Length | 9.64567 in |
| Width | 6.69291 in |
| Height | 27.55906 in |
PRODUCT FAQ
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What is the 3M™ Thermally Conductive Silicone Interface Pad 5549S?
The 3M™ Thermally Conductive Silicone Interface Pad is a high-performance thermal interface material designed to efficiently transfer heat away from electronic devices.
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What are the dimensions of this product?
The pad measures 210 mm x 155 mm x 0.5 mm, making it suitable for use in a variety of electronic applications.
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How does this product compare to other thermal interface materials on the market?
Our thermally conductive silicone interface pad provides excellent performance in terms of thermal conductivity and stability over a wide temperature range. It also has great compressibility and conformability properties, ensuring proper contact with heat-generating components.
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Can this product be easily installed by someone without specialized training or experience?
Yes! This thermally conductive silicone interface pad is very easy to install, and requires no special training or tools. Simply cut it to size and place it between your device's heatsink and PCB or housing.
3M™ Thermally Conductive Silicone Interface Pad 5549S has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.