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3M™ Thermally Conductive Interface Pad Sheet 5519, 210 mm x 155 mm x 2.0 mm, 20/Case
$56.69 / Sheet
| SKU | 7100139349 |
|---|---|
| Legacy SKU | WX300909651 |
| UPC | 00051115240850 |
| Catalog Number | 5519 |
| Product Number | 5519-20 |
3M Thermally Conductive Silicone Interface Pad 5519 is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.
- Very high thermal conductivity (4.9 W/m-K)
- Hardness :Shore 00 = 70
- Good softness and conformability even to non-flat surfaces
- Slight tack allows pre-assembly
- Good wettability for better thermal conductivity
- Good dielectric properties
Product Dimensions |
Imperial | Metric |
| Weight | 0 NULL | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
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Shipping Dimensions |
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| Weight | 9.40051 lb |
|---|---|
| Length | 8.46457 in |
| Width | 6.69291 in |
| Height | 2.3622 in |
PRODUCT FAQ
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What is the 3M™ Thermally Conductive Interface Pad Sheet 5519?
The 3M™ Thermally Conductive Interface Pad Sheet 5519 is a high-performance, thermally conductive interface pad designed to transfer heat from a heat-generating component to a heatsink or chassis.
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How large are the sheets of this product?
These sheets measure at dimensions of 210 mm x 155 mm x 2.0 mm.
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How do I install it on my electronic devices and components?
The application can be done using one of many different methods such as cut pieces peeled onto surfaces, with or without adhesives already attached to both sides, perfect for your convenience!
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Can it prevent my electronic equipment from overheating?
Yes! This product has been designed specifically for thermal management applications where efficient cooling is critical in order to improve reliability and extend device life cycles.
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Is this product available in bulk orders?
Yes! It's shipped in boxes containing up to twenty (20) pieces per case, so you'll never run out when you need it most!
3M™ Thermally Conductive Silicone Interface Pad 5519 has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.