3M™ Thermally Conductive Acrylic Interface Pad 5589H is a very conformable and soft pad with high thermal conductivity of 2.0 W/m-K (3M test method). This pad consists of a slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.
- Good softness and conformability to non-flat surfaces
- Excellent compressive stress relaxation
- Non-silicone acrylic elastomer
- Good dielectric performance
- Good surface tack leads to low thermal resistance at surface
- Thickness : 1.0 mm, 1.5 mm
- Excellent durability for long term thermal conductivity and electric insulation stability
|Width||9.449 in||240 mm|
|Length||21.872 yd||20 m|
Brochures, Catalogs & Data Sheets
- Pdf Data Sheets_3m thermally condu
- Data Sheet
3M™ Thermally Conductive Acrylic Interface Pad 5589H has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management
Electric vehicle (EV) batteries
Wireless charging units
Process control equipment
Test & measurement devices