3M™ Thermally Conductive Acrylic Interface Pad 5590PI consists of thin polyimide film and highly conformable, slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. This pad is designed to provide a preferential heat transfer path between heat generating components and heat sinks. It offers high thermal conductivity and heat stability.
- Flame retardant, UL 94 V-0
- No silicone/siloxane gas, which can cause electric connection failure
- Incorporates a thin polyimide film for good handling
- Good thermal conductivity, heat resistance and electrical insulation properties
- Good softness and conformability even to non-flat IC surfaces
- Slight tack allows pre-assembly
- Good wettability for better thermal conductivity
|Width||9.055 in||230 mm|
|Length||13.78 in||350 mm|
Brochures, Catalogs & Data Sheets
- Pdf Brochures_3m thermal managemen
- Data Sheet
3M™ Thermally Conductive Acrylic Interface Pad 5590PI has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. This pad performs well in high temperatures, maintaining its thermal conductivity and softness. Incorporated thin polyimide film and low tacky acrylic elastomer provide easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Our family of 3M™ Thermally Conductive Acrylic Interface Pads are low outgassing alternative solutions for customers concerned with siloxane gas. No siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. These pads are lightweight, making them ideal for applications with finer spacing rules and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to help protect against electrical interference and device breakdown.
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Automotive battery assembly
Wireless charging units
Process control equipment
Test & measurement devices