| SKU | 7100412704 |
|---|---|
| Legacy SKU | XP003859418 |
| UPC | 06936177936153 |
| Catalog Number | 30035 |
| Product Number | 30035 |
3M UV Activated Tape 30035 is a translucent, UV-curable, high-strength bonding tape that handles like a pressure-sensitive adhesive (PSA) before activation. Featuring a middle carrier film for easy converting and application before curing, this tape provides good impact resistance to meet industry drop test requirements and offers high bond strength while ensuring good removability. With the added benefits of initial tackiness and very low shrinkage, 3M UV Activated Tape 30035 is an ideal bonding option for
- BONDING, REIMAGINED: Offers easier application compared to liquid adhesives while activating with light, rather than heat
- ENHANCED PERFORMANCE: Delivers good impact resistance and high bond strength with good reworkability
- FAMILIAR FEEL: Processes and performs like a pressure-sensitive adhesive (PSA) before UV activation, including the ability to die cut for precision bonding
- CURING TIME: Achieves immediate green strength and full bond strength at room temperature within 24 hours following UV activation
- VARIOUS SUBSTRATES: Bonds opaque and transparent substrates, creating excellent bond strength on most medium and high surface energy materials
- MIDDLE CARRIER FILM: Features a middle carrier film for easy converting and application before curing
Product Dimensions |
Imperial | Metric |
| Weight | 46.738 lbs | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null |
Shipping Dimensions |
|
| Weight | 52.24956 lb |
|---|---|
| Length | 28.97638 in |
| Width | 11.65354 in |
| Height | 12.48031 in |
| Color | Translucent |
|---|
PRODUCT FAQ
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What is 3M™ UV Activated Tape 30035 used for?
This tape is designed for splicing applications where you need a quick, reliable bond. It activates and cures when exposed to ultraviolet light, making it perfect for high-speed production environments where you need fast turnaround times.
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What are the dimensions of this product?
The tape comes in a roll that's 584 mm wide and 66 meters long, with one roll per case. This generous length gives you plenty of material for most splicing jobs.
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How does the UV activation process work?
Once you apply the tape to your materials, simply expose it to UV light and it will activate and cure. This means you don't have to wait for traditional adhesives to dry – the UV light does the work for you, saving you time in your production process.
3M UV Activated Films and Tapes represent an innovative adhesive solution that skillfully merges the advantages of three distinct bonding methodologies into a single, high-performance product. These advanced materials deliver superior adhesive strength when compared to conventional tape products, while simultaneously offering simplified application procedures that rival the ease of use associated with liquid adhesive systems. Unlike traditional heat-activated bonding solutions, these films and tapes utilize ultraviolet light as their activation mechanism, providing manufacturers with greater flexibility in their production processes.
Prior to exposure to ultraviolet radiation, these films and tapes maintain their stability while exhibiting tackiness at ambient room temperature conditions. This characteristic allows them to be readily converted into custom-shaped, precision die-cut components without requiring specialized handling or storage conditions. Following UV activation, the adhesive develops its full bonding capacity at room temperature, delivering immediate initial bond strength and progressing to semi-structural bonding capabilities within a twenty-four hour period. This performance profile makes them particularly well-suited for assembly applications where exposure to elevated temperatures or significant mechanical pressure could compromise component integrity or product quality.
Recommended Applications- Laptop trackpads and input devices
- Fingerprint sensor assembly
- Smartphone front-facing camera modules
- Automotive display panels
- Electronic enclosure bonding
- Heat-sensitive component assembly

