| SKU | 7100025880 |
|---|---|
| Legacy SKU | WT300955802 |
| UPC | 18806080086076 |
| Product Number | 5571 |
3M Thermally Conductive Acrylic Interface Pad 5571 is a thermal interface material designed to provide a heat transfer path from heat-generating components to a cooling device (e.g., aluminum plate or heat sink) to improve device reliability and component lifespan. This product can be used for different applications including EV battery thermal management and more.
- UL94 V-0 listed
- Does not contain intentionally added silicone, so there is not siloxane VOC or oil bleeding, which are associated with silicone products
- Conformable even for non-flat surfaces
- Good conformability to fill gaps for excellent thermal conductivity
- Good electrical insulation properties
- Soft, compliant material allows for pressure relaxation, helping to reduce high pressure zones on components
Product Dimensions |
Imperial | Metric |
| Weight | 57.32019 lbs | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null | |
| Thickness | 78.74 mil | 2 mm |
Shipping Dimensions |
|
| Weight | 58.4225 lb |
|---|---|
| Length | 11.81102 in |
| Width | 9.05512 in |
| Height | 9.05512 in |
| Color | Yellowish White |
|---|
PRODUCT FAQ
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What is this product mainly used for?
The 3M™ Thermally Conductive Acrylic Interface Pad 5571 is designed to efficiently transfer heat between components and heat sinks in electronic devices. It fills microscopic air gaps and irregularities between surfaces, allowing better thermal contact and heat dissipation.
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What are the dimensions of this product?
This roll measures 300 mm in width and comes in a 20-meter length, giving you plenty of material to work with on your projects. One roll is included per case.
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Is this pad sticky, and will it hold components in place?
Yes, this acrylic-based pad has excellent adhesive properties on both sides, so it will securely bond your components together while also providing the thermal conductivity you need for heat management.
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Can I cut this pad to fit different sizes?
Absolutely! Since it comes as a 20-meter roll, you can easily cut it to whatever dimensions your application requires, making it very versatile for various electronic assembly projects.
The 3M Thermally Conductive Acrylic Interface Pad 5571 features a medium-soft composition that readily adapts to irregular and uneven surface profiles. This adaptive quality, combined with superior wettability characteristics, enables the pad to effectively fill microscopic gaps and voids between components, thereby enhancing overall thermal transfer efficiency. The product incorporates a thin, resilient, and low-tack surface layer that facilitates straightforward handling during pre-assembly operations and enables precision die-cutting without compromising structural integrity. This advanced thermal interface material delivers dependable thermal management solutions across a diverse array of industrial sectors, including consumer electronics, automotive systems, LED lighting applications, medical device manufacturing, communication infrastructure, and aerospace and defense technologies.
The 3M Thermally Conductive Acrylic Interface Pad family represents a significant advancement in thermal management technology, offering low-outgassing formulations that deliver superior performance characteristics when compared to traditional silicone-based alternatives. Unlike silicone products, these acrylic-based pads are formulated to eliminate siloxane volatile organic compounds and prevent problematic oil migration, both of which can potentially compromise device reliability and longevity. The lightweight construction of these interface pads makes them particularly well-suited for applications requiring minimal spacing between components and those with stringent footprint constraints. Additionally, the pads provide robust electrical insulation properties that effectively mitigate electromagnetic interference risks and safeguard against electrical component degradation.
Recommended Applications- Thermal transfer pathways between printed circuit boards and heat dissipation devices
- Mitigation of mechanical compression forces on sensitive electronic components through strategic pad placement
- Filling and sealing of air gaps within electronic assemblies
- Thermal management solutions for chip-on-film packaging configurations
- Heat dissipation systems for high-power electronic components
- LED display systems and backlighting solutions
- Electric vehicle battery thermal management
- Wireless power transfer systems
- Satellite positioning and navigation equipment
- Industrial and environmental sensing devices
- Manufacturing process control and monitoring equipment
- Electronic testing and measurement instrumentation


