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SKU 7100418457
Legacy SKU 80001448754
UPC 00068060488152
Product Number 7303

3M Anisotropic Conductive Film 7303 is an epoxy/acrylate-blend adhesive system filled with 43 micron silver-coated glass beads. It is slightly tacky at room temperature and cures at modest bonding temperature and pressure.

  • Heat cure
  • Thermo-set low temperature cure
  • Tacky at room temperature
  • Good thermal stability
  • Reworkable
  • Frozen storage
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On it's way to you February 3  

Qty

Minimum Order 100 Rolls
Order Increment 100 Rolls
Product Dimensions
Imperial Metric
Weight 0.184 lbs
Width 7-1/2 in
Length 1/2 in
Height 6.3748 in
Thickness 6.85 mil
Shipping Dimensions
Weight 1.2 lb
Length 9 in
Width 8 in
Height 4.75 in
Color Tan

PRODUCT FAQ

  1. What is 3M™ Anisotropic Conductive Film Adhesive 7303 used for?

    It's a specialized adhesive film designed to create electrical connections while maintaining insulation in other directions. It's commonly used in electronics assembly, particularly for connecting components in LCD displays, flex circuits, and other precision electronic applications.

  2. What does the "2.5MM x 35 M" specification mean?

    The 2.5MM is the width of the film, and 35 M refers to the length being 35 meters. This gives you a nice roll size that's practical for many production environments.

  3. How many rolls come in each case?

    Each case contains 10 rolls, so you're getting a total of 350 meters of 2.5MM-wide film per case, which provides good coverage for most assembly operations.

  4. What makes anisotropic conductive film different from regular adhesive?

    Regular adhesive conducts electricity uniformly in all directions, but anisotropic conductive film only conducts electricity vertically (through the thickness) while remaining insulative horizontally. This allows for precise, controlled connections between components.

  5. Is 3M™ Anisotropic Conductive Film Adhesive 7303 easy to apply?

    Yes, it's designed for straightforward application in manufacturing settings. It has good tack properties and can be cut to your needed dimensions, making it convenient to work with in your assembly process.

Product Composition and Characteristics

This unbonded film material exhibits a slightly tacky surface when maintained at room temperature, functioning as a thermosetting adhesive system that combines epoxy and acrylate components into a unified matrix. The adhesive matrix is engineered with a random distribution of conductive particles strategically incorporated throughout its structure. These conductive particles serve a dual purpose: they facilitate electrical interconnection of circuit pathways through the thickness of the adhesive layer while maintaining sufficient spatial separation to preserve the material's electrical insulating properties within the plane of the adhesive itself.

Performance Specifications and Material Advantages

The formulation incorporates hard conductive particles as the preferred choice for applications involving copper traces and circuitry. These rigid particles possess the ability to embed themselves into copper trace surfaces, creating enhanced mechanical and electrical contact points that contribute to superior electrical performance and connection reliability. The strategic use of hard particle composition ensures optimal signal integrity and reduced contact resistance at critical connection interfaces.

Applications
  • Bonding flexible printed circuits to other flexible printed circuits
  • Bonding flexible printed circuits to rigid printed circuit boards
  • Establishing electrical interconnections in multilayer circuit assemblies
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