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3M™ Anisotropic Conductive Film Adhesive 7303, 5MM x 35 M, 10 Rolls/Case
$512.68 / Roll
| SKU | 7100418728 |
|---|---|
| Legacy SKU | 80001448788 |
| UPC | 00068060488183 |
| Product Number | 7303 |
3M Anisotropic Conductive Film 7303 is an epoxy/acrylate-blend adhesive system filled with 43 micron silver-coated glass beads. It is slightly tacky at room temperature and cures at modest bonding temperature and pressure.
- Heat cure
- Thermo-set low temperature cure
- Tacky at room temperature
- Good thermal stability
- Reworkable
- Frozen storage
Product Dimensions |
Imperial | Metric |
| Weight | 0.273 lbs | |
|---|---|---|
| Width | 7-1/2 in | |
| Length | 1/2 in | |
| Height | 6.3748 in | |
| Thickness | 6.85 mil |
Shipping Dimensions |
|
| Weight | 1.641 lb |
|---|---|
| Length | 9 in |
| Width | 8 in |
| Height | 4.75 in |
| Color | Tan |
|---|
PRODUCT FAQ
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What is 3M™ Anisotropic Conductive Film Adhesive 7303 used for?
This product is designed for bonding and electrically connecting components in electronics assembly. It conducts electricity vertically through the adhesive while remaining electrically insulating horizontally, making it ideal for connecting flat panel displays, semiconductors, and other precision electronic components.
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What are the dimensions of each roll in this case?
Each roll measures 5MM in width and 35 meters in length. You'll receive 10 rolls per case, giving you plenty of material for your production needs.
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How does anisotropic conductive film differ from regular adhesive?
Unlike standard adhesives, anisotropic conductive film contains conductive particles that allow electrical current to flow in one direction only—perpendicular to the film surface. This enables simultaneous mechanical bonding and electrical connection without requiring solder or additional connectors.
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What industries typically use this product?
This adhesive is commonly used in consumer electronics manufacturing, including smartphones, tablets, laptops, automotive displays, and medical devices. Any application requiring reliable electrical connections combined with strong mechanical bonds benefits from this specialized product.
This specialized unbonded film exhibits a slightly tacky surface characteristic when maintained at ambient temperature. The material is engineered with a thermosetting epoxy/acrylate adhesive foundation that serves as the primary matrix. Throughout this adhesive matrix, conductive particles are distributed in a random pattern, creating a composite material with unique electrical properties tailored for interconnection applications.
The conductive particles embedded within the adhesive system play a critical role in the film's functionality. These particles are strategically positioned to enable electrical connection between circuit traces that traverse through the thickness of the adhesive layer. Simultaneously, the particles maintain sufficient spacing from one another to preserve the adhesive's electrical insulating characteristics when measured in the plane parallel to the adhesive surface, making it ideal for applications requiring controlled conductivity in specific directions.
Material Selection and ApplicationsFor optimal performance with copper circuit traces, hard conductive particles are the preferred choice. These rigid particles possess the ability to embed themselves into copper traces during the bonding process, resulting in superior electrical connectivity and enhanced overall performance of the assembled component.
Bonding Capabilities- Bonding of flexible printed circuits to other flexible printed circuits
- Bonding of flexible printed circuits to standard printed circuit boards
- 3M ACF 7303 formulation specifically designed for these interconnection purposes
