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3M™ Thermal Bonding Film 588, 1 in x 60 yds, 40/Case, Bulk
$67.92 / Roll
| SKU | 7000001105 |
|---|---|
| Legacy SKU | 70002512138 |
| UPC | 00021200034527 |
| Catalog Number | 588 |
| Product Number | 588 |
3M Thermal Bonding Film 588 is a high strength, flexible, nitrile phenolic-based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
- Flexible
- Heat or solvent activation
- Can be die-cut
- Heat crosslinkable option
Product Dimensions |
Imperial | Metric |
| Weight | 5.8 lbs | |
|---|---|---|
| Width | 13.8 in | |
| Length | 3 in | |
| Height | 13.8 in | |
| Thickness | 11 mil | 0.28 mm |
Shipping Dimensions |
|
| Weight | 24.49997 lb |
|---|---|
| Length | 13.89764 in |
| Width | 13.89764 in |
| Height | 13.77953 in |
| Color | Yellow |
|---|
PRODUCT FAQ
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How do I know if the 3M™ Thermal Bonding Film 588 is suitable for my project?
The 3M™ Thermal Bonding Film 588 is ideal for applications requiring high bond strength, thermal conductivity, and chemical resistance.
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Can the film be easily cut to size for my specific needs?
Yes, the 3M™ Thermal Bonding Film 588 can be easily cut to size with scissors or a utility knife to fit your desired dimensions.
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Is this product easy to apply?
Yes, the film has a pressure-sensitive adhesive backing that makes application quick and convenient. Simply peel off the liner and press it onto your surface.
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How does this thermal bonding film perform in high temperature environments?
The 3M™ Thermal Bonding Film 588 is designed to withstand high temperatures up to +200°C (+392°F), making it suitable for various industrial applications where heat resistance is crucial.
3M Thermal Bonding Film 588 is an advanced adhesive solution designed specifically for splicing glass fabric during PCB board manufacturing. It is a thicker version of the highly reliable 3M Thermal Bonding Film 583, offering enhanced bonding capabilities and improved performance.
This hot melt film adhesive is specially formulated to provide excellent adhesion and durability, ensuring a strong and reliable bond between glass fabric layers. It can be easily activated using solvents in its uncured form, allowing for convenient and efficient application.
Once applied, 3M Thermal Bonding Film 588 undergoes a heat curing process, further enhancing its bonding strength and ensuring long-lasting performance. This film adhesive is engineered to withstand the demanding conditions of PCB board manufacturing, providing reliable splicing solutions that meet industry standards.
With a standard lead time of 30 calendar days, 3M Thermal Bonding Film 588 offers a reliable and efficient solution for splicing glass fabric during PCB board manufacturing. Trust 3M's expertise and innovative adhesive technologies to enhance your manufacturing processes and deliver superior results.