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SKU 7000142778
Legacy SKU 62003701513
UPC 00021200437670
Catalog Number 588
Product Number 588

3M Thermal Bonding Film 588 is a high strength, flexible, nitrile phenolic-based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

  • Flexible
  • Heat or solvent activation
  • Can be die-cut
  • Heat crosslinkable option
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On it's way to you June 21  

Qty

Minimum Order 80 Rolls
Order Increment 80 Rolls
Product Dimensions
Imperial Metric
Weight 0 NULL
Width 0 null
Length 0 null
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Shipping Dimensions
Weight 24.49997 lb
Length 13.89764 in
Width 13.89764 in
Height 13.77953 in

PRODUCT FAQ

  1. I'm glad you asked! Here are some common questions and friendly answers about 3M's Thermal Bonding Film 588

    How long is the roll of 3M™ Thermal Bonding Film 588 in inches?

  2. The roll size of our Thermal Bonding Film 588 is half an inch wide by 60 yards long.

    Can this bonding film withstand high temperatures?

  3. Yes, this bonding film has excellent thermal resistance properties to withstand various temperature conditions.

    How many rolls come in a case of the 3M™ Thermal Bonding Film 588?

  4. A case of the Thermal Bonding Film contains a total of 80 rolls for your convenience.

    Is the adhesive on this film strong enough for industrial use?

  5. Absolutely, the adhesive on our Thermal Bonding Film is designed for industrial applications providing reliable bonding strength.

    Can I easily cut or shape this bonding film for my project needs?

  6. Yes, you can easily cut and shape the Thermal Bonding Film to suit your specific project requirements. It's versatile and user-friendly!

3M Thermal Bonding Film 588

3M Thermal Bonding Film 588 is an enhanced version of the popular 3M Thermal Bonding Film 583. This innovative hot melt film adhesive is specifically designed for splicing glass fabric during the manufacturing process of printed circuit boards (PCBs).

With its superior thickness, 3M Thermal Bonding Film 588 offers enhanced bonding strength and durability, ensuring reliable and long-lasting splices. This adhesive film can be easily activated using solvents in its uncured form, providing flexibility and ease of use during the splicing process.

Furthermore, 3M Thermal Bonding Film 588 is a heat-curing film, which means it can be efficiently cured using heat, resulting in a strong and secure bond between the glass fabric layers. This heat-curing capability ensures the integrity and stability of the spliced PCB boards.

At 3M, we understand the importance of timely delivery. The standard lead time for 3M Thermal Bonding Film 588 is 30 calendar days, allowing you to plan your manufacturing process efficiently and meet your production deadlines.

Choose 3M Thermal Bonding Film 588 for your PCB board manufacturing needs and experience the superior bonding performance and reliability that 3M products are known for.

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