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SKU 7000048450
Legacy SKU 70006039591
UPC 00021200056246
Catalog Number 588
Product Number 588

3M Thermal Bonding Film 588 is a high strength, flexible, nitrile phenolic-based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

  • Flexible
  • Heat or solvent activation
  • Can be die-cut
  • Heat crosslinkable option
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On it's way to you June 4  

Qty

Minimum Order 20 Rolls
Order Increment 20 Rolls
Product Dimensions
Imperial Metric
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Width 0 null
Length 0 null
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Shipping Dimensions
Weight 38.99977 lb
Length 13.89764 in
Width 13.89764 in
Height 13.77953 in

PRODUCT FAQ

  1. Is the 3M™ Thermal Bonding Film 588 easy to use?

    Yes, the 3M™ Thermal Bonding Film 588 is designed for ease of use, making it simple and straightforward to apply.

  2. Can I use this bonding film on various materials?

    Absolutely! The 3M™ Thermal Bonding Film 588 is versatile and suitable for bonding a wide range of substrates including plastics, metals, and composites.

  3. How long does the bonding last once applied?

    Once properly adhered using heat or pressure, the bond created by the 3M™ Thermal Bonding Film 588 is strong and durable for long-lasting performance.

  4. Is this product environmentally friendly?

    Yes, the 3M™ Thermal Bonding Film 588 is free from harmful chemicals like VOCs (volatile organic compounds), making it an environmentally conscious choice.

3M Thermal Bonding Film 588

3M Thermal Bonding Film 588 is an enhanced version of the popular 3M Thermal Bonding Film 583. This advanced hot melt film adhesive is specifically designed for splicing glass fabric during the manufacturing process of printed circuit boards (PCBs). It offers a thicker profile, providing increased strength and durability for demanding applications.

One of the key features of 3M Thermal Bonding Film 588 is its versatility. It can be activated using solvents in its uncured form, allowing for easy application and adjustment. Once applied, the film can be heat-cured, ensuring a strong and reliable bond between the glass fabric layers.

With a standard lead time of 30 calendar days, 3M Thermal Bonding Film 588 is readily available to meet your production needs. Its high-performance characteristics make it an ideal choice for PCB manufacturers seeking a reliable and efficient solution for glass fabric splicing.

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