SKU | 7000048414 |
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Legacy SKU | 70006022597 |
UPC | 00021200043956 |
Catalog Number | 588 |
Product Number | 588 |
3M Thermal Bonding Film 588 is a high strength, flexible, nitrile phenolic-based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
- Flexible
- Heat or solvent activation
- Can be die-cut
- Heat crosslinkable option
Product Dimensions |
Imperial | Metric |
Weight | 0 NULL | |
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Width | 0 null | |
Length | 0 null | |
Height | 0 null |
Shipping Dimensions |
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Weight | 24.49997 lb |
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Length | 13.89764 in |
Width | 13.89764 in |
Height | 13.8189 in |
PRODUCT FAQ
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What are the main benefits of using 3M™ Thermal Bonding Film 588?
The main benefits of our Thermal Bonding Film 588 include strong bonding capabilities, excellent thermal conductivity, and easy application.
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Is this product suitable for high-temperature applications?
Yes, our Thermal Bonding Film 588 is designed to withstand high temperatures, making it ideal for various industrial applications.
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How many rolls come in a case of the 1-1/4 in x 60 yds size?
Each case contains a total of 32 rolls of the 1-1/4 in x 60 yds Thermal Bonding Film. This bulk packaging provides great value for your needs.
3M Thermal Bonding Film 588 is an enhanced version of the popular 3M Thermal Bonding Film 583. This advanced hot melt film adhesive is specifically designed for splicing glass fabric during the manufacturing process of printed circuit boards (PCBs). It offers a thicker profile, providing increased strength and durability for demanding applications.
One of the key features of 3M Thermal Bonding Film 588 is its versatility. It can be activated using solvents in its uncured form, allowing for easy application and adjustment. Once applied, the film can be heat-cured, ensuring a strong and reliable bond between the glass fabric layers.
With a standard lead time of 30 calendar days, 3M Thermal Bonding Film 588 is readily available to meet your production needs. Its high-performance characteristics make it an ideal choice for PCB manufacturers seeking a reliable and efficient solution for glass fabric splicing.